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Fine laser cutting of silicon wafers

Copyright of ©2006 Fraunhofer Institute IWS Dresden
Copyright of ©2006 Fraunhofer Institute IWS Dresden
Copyright of ©2006 Fraunhofer Institute IWS Dresden

Structures in silicon wafers front side showing cut with the diode-pumped solid state ultraviolet laser (GATOR UV). For process details see ’Micro cutting and drilling with ultra-violet laser light’ [link to IWS_info_84e.pdf].



 

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Copyright of ©2006 Fraunhofer Institute IWS Dresden
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